| Test Item |
Referred standard |
Test
conditions |
Purpose of
the test |
| Temperature cycling |
- MIL-STD-883C-1010.7
- EIAJ ED-4701B-131
|
- 65
°C
to 150 °C |
Check device's resistance to the cycling
change of temperature from high extreme to low extreme. |
| Thermal shock |
- MIL-STD-883C-1011-7
- EIAJ ED-4701-B-141
|
0
°C to 100
°C |
Check device's resistance to abrupt, rapid
change in temperature. |
|
High-temperature storage |
- MIL-STD-883C-1008.2
- EIAJ ED-4701B-111
|
Tamb= 150
°C |
Check device's
resistance to high-temperature storage environment. |
| Low
temperature storage |
|
Tamb= -65
°C |
Check device's
resistance to low-temperature storage environment. |
| Moisture
resistance |
|
Tamb= 85
°C,
85% RH |
Check device's
resistance to an environment with high temperature and high relative
humidity, for a long period of operation and storage. |
| Salt
atmosphere |
- EIAJ ED-4701B-144
- MIL-STD-202F-101D
|
35
°C,
5% brine spray, 48 hours |
Check device's
resistance to corrosion in a salty environment, such as costal area. |
| Pressure
cooker |
|
2 atmospheric
pressures, 121 °C. |
Check device's
resistance to accelerated humidity change. |
| Resistance to
high temperature during soldering |
- EIAJ ED-4701-A-132, A-133
|
260
°C,
10 seconds (solder bath) |
Check the
device's resistance to high temperature during soldering. |
| Resistance to
chemical corrosion from solvents |
- EIAJ ED-4701C-131
- MIL-STD-883C-2015-8
|
Isopropyl
alcohol, 10 minutes |
Check device
marking's resistance to solvent. (only applicable to printed marking;
laser marking may be used for some devices.) |
|
High-temperature operating |
- EIAJ ED-4701D-101
- MIL-STD-883C-1005-6
|
Tamb= 125
°C,
steady operation |
Check device's durability of operation
with both electrical stress and thermal stress applied for a long
period of time. |
| Moisture
resistance ( with bias) |
|
Tamb= 85
°C,
85% RH, rated voltage applied |
Check the
device's durability in an environment with high relative humidity. |